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INTEGRATED CIRCUITS
DATA SHEET
TDA1020 12 W car radio power amplifier
Product specification File under Integrated Circuits, IC01 November 1982
Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
The TDA1020 is a monolithic integrated 12 W audio amplifier in a 9-lead single in-line (SIL) plastic package. The device is primarily developed as a car radio amplifier. At a supply voltage of VP = 14,4 V, an output power of 7 W can be delivered into a 4 load and 12 W into 2 . To avoid interferences and car ignition signals coming from the supply lines into the IC, frequency limiting is used beyond the audio spectrum in the preamplifier and the power amplifier. The maximum supply voltage of 18 V makes the IC also suitable for mains-fed radio receivers, tape recorders or record players. However, if the supply voltage is increased above 18 V (< 45 V), the device will not be damaged (load dump protected). Also a short-circuiting of the output to ground (a.c.) will not destroy the device. Thermal protection is built-in. As a special feature, the circuit has a low stand-by current possibility. The TDA1020 is pin-to-pin compatible with the TDA1010. QUICK REFERENCE DATA Supply voltage range Repetitive peak output current Output power at dtot = 10% (with bootstrap) VP = 14,4 V; RL = 2 VP = 14,4 V; RL = 4 VP = 14,4 V; RL = 8 Output power at dtot = 10% (without bootstrap) VP = 14,4 V; RL = 4 Input impedance preamplifier (pin 8) power amplifier (pin 6) Total quiescent current at VP = 14,4 V Stand-by current Storage temperature range Crystal temperature |Zi| |Zi| Itot Isb Tstg Tc max. typ. typ. typ. < 40 k 40 k 30 mA 1 mA -55 to + 150 C 150 C Po > 4,5 W Po Po Po > typ. typ. typ. 10 W 12 W 7W 3,5 W VP IORM < 6 to 18 V 4A
PACKAGE OUTLINE 9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 24.
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
Fig.1 Internal block diagram; the heavy lines indicate the signal paths.
PINNING 1. Negative supply (substrate) 2. Output power stage 3. Positive supply (VP) 4. Bootstrap 5. Ripple rejection filter 6. Input power stage 7. Output preamplifier 8. Input preamplifier 9. Negative supply
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage; operating (pin 3) Supply voltage; non-operating Supply voltage; load dump Non-repetitive peak output current Total power dissipation Storage temperature range Crystal temperature Short-circuit duration of load behind output electrolytic capacitor at 1 kHz sine-wave overdrive (10 dB); V = 14,4 V tsc max. VP VP VP IOSM Tstg Tc max. max. max. max. max.
TDA1020
18 V 28 V 45 V 6A -55 to + 150 C 150 C 100 hours
see derating curves Fig.2
Fig.2 Power derating curves.
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
HEATSINK DESIGN EXAMPLE
TDA1020
The derating of 8 K/W of the encapsulation requires the following external heatsink (for sine-wave drive): 10 W in 2 at VP = 14,4 V maximum sine-wave dissipation: 5,2 W Tamb = 60 C maximum 150 - 60 R th j-a = R th j-tab + R th tab-h + R th h-a = --------------------- = 17,3 K/W 5, 2 Since Rth j-tab + Rth tab-h = 8 K/W, Rth h-a = 17,3 - 8 9 K/W. D.C. CHARACTERISTICS Supply voltage range (pin 3) Repetitive peak output current Total quiescent current at VP = 14,4 V at VP = 18 V Itot Itot typ. typ. 30 mA 40 mA VP IORM < 6 to 18 V 4A
A.C. CHARACTERISTICS Tamb = 25 C; VP = 14,4 V; RL = 4 ; f = 1 kHz; unless otherwise specified; see also Fig.3 Output power at dtot = 10%; with bootstrap (note 1) VP = 14,4 V; RL = 2 VP = 14,4 V; RL = 4 VP = 14,4 V; RL = 8 Output power at dtot = 1%; with bootstrap (note 1) VP = 14,4 V; RL = 2 VP = 14,4 V; RL = 4 VP = 14,4 V; RL = 8 Output voltage (r.m.s. value) RL = 1 k; dtot = 0,5% Output power at dtot = 10%; without bootstrap Voltage gain preamplifier (note 2) power amplifier total amplifier Gv1 Gv2 Gv tot typ. typ. typ. 17,7 dB 16,7 to 18,7 dB 29,5 dB 28,5 to 30,5 dB 47 dB 46,2 to 48,2 dB Vo(rms) Po typ. > 5V 4,5 W Po Po Po typ. typ. typ. 9,5 W 6W 3W Po Po Po > typ. > typ. typ. 10 W 12 W 6W 7W 3,5 W
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
Input impedance preamplifier power amplifier Output impedance preamplifier power amplifier Output voltage (r.m.s. value) at dtot = 1% preamplifier (note 2) Frequency response Noise output voltage (r.m.s. value; note 3) RS = 0 RS = 8,2 k Ripple rejection (note 4) at f = 100 Hz; C2 = 1 F at f = 1 kHz to 10 kHz Bootstrap current at onset of clipping (pin 4) RL = 4 and 2 Stand-by current (note 5) Crystal temperature for -3 dB gain Notes 1. Measured with an ideal coupling capacitor to the speaker load. 2. Measured with a load resistor of 40 k. 3. Measured according to IEC curve-A. 4. Maximum ripple amplitude is 2 V; input is short-circuited. 5. Total current when disconnecting pin 5 or short-circuited to ground (pin 9). 6. The tab must be electrically floating or connected to the substrate (pin 9). I4 Isb Tc typ. < > RR RR typ. > typ. Vn(rms) Vn(rms) typ. < typ. < Vo(rms) B > typ. |Zo| |Zo| typ. typ. |Zi| |Zi| typ. typ.
TDA1020
40 k 28 to 52 k 40 k 28 to 52 k 2,0 k 1,4 to 2,6 k 50 m 1V 1,5 V 50 Hz to 25 kHz 0,3 mV 0,5 mV 0,5 mV 1,0 mV 44 dB 48 dB 54 dB 40 mA 1 mA 150 C
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
TDA1020
(1) With RL = 2 , preferred value of C8 = 2200 F.
Fig.3 Test circuit.
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
PACKAGE OUTLINE SIL9MPF: plastic single in-line medium power package with fin; 9 leads
TDA1020
SOT110-1
D
D1 q P P1 A2
A3 q1 q2
A A4 seating plane E pin 1 index
L 1 Z b2 e b b1 wM 9 Q
c
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1.0
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-02-25
November 1982
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Preliminary Specification
Philips Semiconductors
Product specification
12 W car radio power amplifier
SOLDERING Introduction
TDA1020
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
November 1982
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Preliminary Specification

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